NOKIA-ALCATEL- LUCENT

Server backpanels from 2012 have a small amount of gold due to the newer generation of technologies.

Ericsson telecommunications PCB manufactured in 2014, but many components are older generation, so the board is classified as a high gold content grade.

2014 telecommunications PCB, visually with a lot of gold-plated surface, but the layer is very thin, so the amount of gold is small.

This Nokia Flexi BTS RF module PCB (900 MHz) from 2014 has many gold-plated contacts and a thick silver shielding layer, resulting in high silver and gold content.

GSM Ericsson TU8X402010, manufactured in 2011, belongs to the telecom category. It contains a small amount of palladium, but the gold content remains very high.

Ericsson ROA 128 868/2 PCB produced in 2012,hese boards are often overvalued due to their complex design and visible quantity of integrated circuits, but their actual precious metal recovery may not match visual expectations.

Network equipment mixed grade until 2009 had high Pd; after 2009, it slightly changed, reaching up to 15–20 ppm maximum.

Back panels mix – a combination of different models. It's important to check the manufacturing year: those made before 2009 contain a very high amount of palladium.